SMT ASSEMBLY “BOOT CAMP”

SMT BOOT CAMP

The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long class, which provides students with the opportunity to learn and understand the processes, tools, and materials used in today’s manufacture of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing related fields.

This 2-day course combines lecture, videos and discussion and is intended for those that are new to electronic assembly and want to “come up to speed” on the processes, materials, equipment and procedures

COURSE OUTLINE

DAY ONE

INTRODUCTION

PCB FABRICATION OVERVIEW

  1. Circuit board manufacture overview
  2. Surface finish
  3. Legend

 

 

 

SMT ASSEMBLY

  • Solder paste
  1. Nomenclature
  2. Manufacture
  3. Solder characteristics
  4. Flux
  5. Solder Paste considerations

 

  • Stencil Fabrication and Design
  1. Chemical etch
  2. Laser cut
  3. Electroplating
  4. Aperture Design rules
  5. Special Aperture

 

  • Solder Paste Printing
  1. Dispensing options
  2. Fiducials
  3. Solder deposition
  4. Process parameters
  5. Process considerations

 

DAY TWO

  • Component placement
  1. Machine types
  2. Feeder types
  3. Placement considerations

 

  • Reflow
  1. Reflow Oven types
  2. Vapor Phase
  3. Profile development
  4. Reflow considerations

 

  • Wave Soldering
  1. Machine types
  2. Profile development
  3. Process considerations

 

 

 

  • Selective Soldering
  1. Machine types
  2. Profile development
  3. Process considerations

 

  • Cleaning
  1. Contaminants and Corresponding Solvents
  2. Effectiveness of Aqueous Detergents
  3. Cleaning Equipment (Batch and in-line systems)
  4. Cleanability of Components
  5. Driving Forces For No Clean
  6. Cleaning No Clean

 

  • Testing
  1. Testing and Controlling the process through SPC
  2. Inspection points and strategies in the process
  3. AOI
  4. XRAY
  5. Testing considerations

 

  • Questions and Answers Session