Calendar

Jul
24
Wed
SMT ASSEMBLY “BOOT CAMP” @ BEST Inc
Jul 24 – Jul 25 all-day

SMT Assembly “Boot Camp”

 

Course Title:                      SMT Assembly “Boot Camp”

Course Instructor:             Phil Zarrow

Duration:                              2 Days

SMT BOOT CAMP

The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long class, which provides students with the opportunity to learn and understand the processes, tools, and materials used in today’s manufacture of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing related fields.

This 2-day course combines lecture, videos and discussion and is intended for those that are new to electronic assembly and want to “come up to speed” on the processes, materials, equipment and procedures

COURSE OUTLINE

 

DAY ONE

INTRODUCTION

 

PCB FABRICATION OVERVIEW

  1. Circuit board manufacture overview
  2. Surface finish
  3. Legend

 

 

 

SMT ASSEMBLY

  • Solder paste
  1. Nomenclature
  2. Manufacture
  3. Solder characteristics
  4. Flux
  5. Solder Paste considerations

 

  • Stencil Fabrication and Design
  1. Chemical etch
  2. Laser cut
  3. Electroplating
  4. Aperture Design rules
  5. Special Aperture

 

  • Solder Paste Printing
  1. Dispensing options
  2. Fiducials
  3. Solder deposition
  4. Process parameters
  5. Process considerations

 

DAY TWO

  • Component placement
  1. Machine types
  2. Feeder types
  3. Placement considerations

 

  • Reflow
  1. Reflow Oven types
  2. Vapor Phase
  3. Profile development
  4. Reflow considerations

 

  • Wave Soldering
  1. Machine types
  2. Profile development
  3. Process considerations

 

 

 

  • Selective Soldering
  1. Machine types
  2. Profile development
  3. Process considerations

 

  • Cleaning
  1. Contaminants and Corresponding Solvents
  2. Effectiveness of Aqueous Detergents
  3. Cleaning Equipment (Batch and in-line systems)
  4. Cleanability of Components
  5. Driving Forces For No Clean
  6. Cleaning No Clean

 

  • Testing
  1. Testing and Controlling the process through SPC
  2. Inspection points and strategies in the process
  3. AOI
  4. XRAY
  5. Testing considerations

 

  • Questions and Answers Session

 

Sep
23
Mon
DEFECT ANALYSIS and PROCESS TROUBLESHOOTING @ SMTAI
Sep 23 all-day
Jim Hall and *Phil Zarrow, ITM Consulting
Monday, September 23 | 8:30am — 12:00pm and 1:30pm – 5:00 pm

Course Objectives
We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design

Topics Covered
Introduction Prevention: Process Development and Validation Variation (Common Cause) Continuous Improvement Defect Definition Failure Reduced Reliability Process Indicator Special Cause vs. Common Cause Defect Identification Inspection Manual AOI X-Ray Test ICT Functional Contamination False Calls / Escapes Causes of Defects Special Cause vs. Common Cause Variability (repeatability) Accuracy Process not Optimized Root Cause Analysis 5 Whys” Cause and Effect Diagram Process Relationships Incoming Materials Handling Process Problems