BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//ITM Consulting - ECPv6.17.5.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:ITM Consulting
X-ORIGINAL-URL:https://itmconsulting.com
X-WR-CALDESC:Events for ITM Consulting
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20210101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20200308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20201101T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20210314T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20211107T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20220313T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20221106T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/New_York
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20200308T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20201101T060000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20210314T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20211107T060000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20220313T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20221106T060000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=UTC:20220124T080000
DTEND;TZID=UTC:20220124T170000
DTSTAMP:20220109T204116Z
CREATED:20220109T204116Z
LAST-MODIFIED:20220109T204116Z
UID:1233-1643011200-1643043600@itmconsulting.com
SUMMARY:TROUBLESHOOTING AND PROCESS OPTIMIZATION
DESCRIPTION:Troubleshooting and Process Optimization\n– Lessons Learned from the Trenches and a Decade of Board Talk \nPhil Zarrow & Jim Hall    ITM Consulting   Full Day      January 24\, 2022  9:00 am – 12:00 pm & 2:00 pm – 5:00 pm  at APEX 2022 \nPD-21 (Part 1) and PD-26 (Part 2) \nIn over 25 years of consulting\, Phil and Jim have just about seen it all! You may be familiar with their popular podcast (started before podcasts existed)\, Board Talk\, which addresses industry issues with deep understanding and a sense of humor. Join the “Assembly Brothers” for a journey through troubleshooting the most common defects in SMT with an emphasis on identifying the fundamental root causes\, and an entertaining overview of best practices. \nTopics Include: \nIssue Questions from the BoardTalk Crypt: \n\nWhy do we get voids in certain solder joints?\nDo we need to clean No-Clean residues before Conformal Coating?\nWhat is Causing Intermittent BGA Failures?\nShould We Measure Solder Paste Thickness?\nAre there effective countermeasures to “new” defects such as “Graping”\, HoP\, etc.?\nShould we consider changing to a newer Solder Paste formulation?\nWhat are the Pros and Cons of Cleaning No-Clean?\nIs HASL a Good Choice for Surface Finish?\nShould we change from Water Soluble fluxes to No-Clean?\nWhat are potential issues with introducing Ultra-miniature chip components into our products?\nWill Nitrogen Reduce Reflow and/or Wave Solder Defects?\nDoes Your Assembly Line Suffer From Floundering Time?\nAre There Standards Governing Component Polarity Marks?\nHow can we reduce tombstoning?\nCan We Skip Cleaning After Rework?\nWhat are the best practices for storing and handling PCB’s?\nHow to build a “proper” profile board to set up a Reflow Oven ?\nWhy has Vapor Phase Reflow come back ?\nHow can we achieve adequate hole fill in wave soldering?\nCan we mix conformal coatings during rework?\nWill typical No-Clean residues pass an SIR Test?\nWhat causes “Icicles” during wave soldering?\nSolder pallets with titanium inserts: yes or no?\nHow do you remove oxidation from PCB’s?\n\nQ & A – “Stump the Chumps”:  Jim and Phil will answer process questions from participants as time permits. \nWho Should Attend: \n\nThis course is intended for Manufacturing\, Process\, Design\, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.  If you’re involved with SMT assembly and you’ve never encountered defects\, you can take a pass on this workshop.
URL:https://itmconsulting.com/event/troubleshooting-and-process-optimization-2/
LOCATION:IPC APEX 2022
ORGANIZER;CN="IPC":MAILTO:AndreaKeefe@IPC.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20210311
DTEND;VALUE=DATE:20210312
DTSTAMP:20201212T160747Z
CREATED:20201212T160747Z
LAST-MODIFIED:20201212T160747Z
UID:981-1615420800-1615507199@itmconsulting.com
SUMMARY:TROUBLESHOOTING AND PROCESS OPTIMIZATION
DESCRIPTION:Troubleshooting and Process Optimization\n– Lessons Learned from the Trenches and a Decade of Board Talk \nPhil Zarrow & Jim Hall    ITM Consulting   Full Day      9:00 am – 12:00 pm & 2:00 pm – 5:00 pm \nIn over 25 years of consulting\, Phil and Jim have just about seen it all! You may be familiar with their popular podcast (started before podcasts existed)\, Board Talk\, which addresses industry issues with deep understanding and a sense of humor. Join the “Assembly Brothers” for a journey through troubleshooting the most common defects in SMT with an emphasis on identifying the fundamental root causes\, and an entertaining overview of best practices. \nTopics Include: \nIssue Questions from the BoardTalk Crypt: \n\nWhy do we get voids in certain solder joints?\nDo we need to clean No-Clean residues before Conformal Coating?\nWhat is Causing Intermittent BGA Failures?\nShould We Measure Solder Paste Thickness?\nAre there effective countermeasures to “new” defects such as “Graping”\, HoP\, etc.?\nShould we consider changing to a newer Solder Paste formulation?\nWhat are the Pros and Cons of Cleaning No-Clean?\nIs HASL a Good Choice for Surface Finish?\nShould we change from Water Soluble fluxes to No-Clean?\nWhat are potential issues with introducing Ultra-miniature chip components into our products?\nWill Nitrogen Reduce Reflow and/or Wave Solder Defects?\nDoes Your Assembly Line Suffer From Floundering Time?\nAre There Standards Governing Component Polarity Marks?\nHow can we reduce tombstoning?\nCan We Skip Cleaning After Rework?\nWhat are the best practices for storing and handling PCB’s?\nHow to build a “proper” profile board to set up a Reflow Oven ?\nWhy has Vapor Phase Reflow come back ?\nHow can we achieve adequate hole fill in wave soldering?\nCan we mix conformal coatings during rework?\nWill typical No-Clean residues pass an SIR Test?\nWhat causes “Icicles” during wave soldering?\nSolder pallets with titanium inserts: yes or no?\nHow do you remove oxidation from PCB’s?\n\nQ & A – “Stump the Chumps”:  Jim and Phil will answer process questions from participants as time permits. \nWho Should Attend: \n\nThis course is intended for Manufacturing\, Process\, Design\, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.  If you’re involved with SMT assembly and you’ve never encountered defects\, you can take a pass on this workshop.
URL:https://itmconsulting.com/event/troubleshooting-and-process-optimization/
LOCATION:IPC APEX EXPO 2021\, Virtual
ORGANIZER;CN="IPC":MAILTO:AndreaKeefe@IPC.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20210121T130000
DTEND;TZID=America/New_York:20210121T170000
DTSTAMP:20201218T180738Z
CREATED:20201218T180738Z
LAST-MODIFIED:20201218T180738Z
UID:990-1611234000-1611248400@itmconsulting.com
SUMMARY:WHAT EVERY DESIGN ENGINEER SHOULD KNOW ABOUT DESIGN FOR SMT MANUFACTURABILITY
DESCRIPTION:In our experience\, at ITM Consulting\, one of the biggest problems\, and cause of defects\, is a lack of DFM. The root cause is that most Designers are not familiar with the processes\, equipment and materials used in SMT assembly. There is a “wall” between Design and Manufacturing.\nPCB2Day would like to contribute to remedying this situation. On January 21 we will present a webinar about what every Design Engineer Should Know About Design for SMT Manufacturability.\nWe invite Design Engineers to learn what the SMT Assembly World is all about! Join us and together let’s “tear down that wall”!
URL:https://itmconsulting.com/event/what-every-design-engineer-should-know-about-design-for-smt-manufacturability/
LOCATION:PCB2Day Webinar
END:VEVENT
END:VCALENDAR