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UID:1243-1660552200-1660755600@itmconsulting.com
SUMMARY:SMT Assembly Boot Camp Master Workshop at BEST Inc\, Rolling Meadows\, IL
DESCRIPTION:The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through hole and surface mount technologies (SMT). It is a focused two-day long workshop\, which provides students with the opportunity to learn and understand the processes\, equipment\, and materials used in today’s manufacturing of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing-related fields. \nCombining a lecture\, discussion\, and some videos\, this electronic assembly basic training workshop was designed to give a very comprehensive and complete “immersion” into SMT and mixed technology PCB assembly. People who are new to the field\, as well as somewhat experienced personnel who want to “fill in the gaps\,” have found this workshop to be a perfect solution. \nAs it runs only two days\, it is extensive (and non-superfluous) without taking people “out of the shop” for an extended period of time: learn\, absorb\, and take that knowledge back to the manufacturing floor. \n\n\n\n\n\n\nDay One: Introduction – “It’s What We Do” \n\nPCB Fabrication Overview\n\nCircuit Board Fabrication Overview\nSurface Finish\nLegend\n\n\nSMT Assembly Materials\nSolder Paste \n\nSolder Paste (Flux and Alloy)\nSolder Paste Characteristics\nSolder Paste Considerations\nAdhesives\n\n\nStencil Fabrication and Design\n\nStencil Components\nStencil Fabrication and Characteristics (Laser Cut\, Electroplating\, and Nano-Coating)\nFiducials\nAperture Design Rules\nSpecial Apertures\n\n\nSMT Assembly Processes and Equipment\nSolder Paste Printing and Deposition\n \n\nSolder Paste (Composition and Attributes)\nSolder Deposition Basics\nProcess Parameters\, Control\, and Effects\nProcess Considerations\nProcess Defect Recognition and Avoidance\nSolder Jetting\n\n\nQuestions and Answers Session\n\n\n\n\n\n\n\n\n\n\n\n\n\nDay Two: Assembly Processes and Equipment (Continued) \n\nComponent Placement\n\nMachine Types and Characteristics\nFeeder Types (Attributes and Characteristics)\nPlacement Considerations and Parameters\nSet-Up and Change-Over\nAvoiding Placement Defects\nLine Balancing\n\n\nReflow Soldering\nReflow Profile \n\nReflow Profile Characteristics\nReflow Specification Derivation\n\n\nPCBA profile development procedure\n\nThermocouple Location\nThermocouple Attachment Methodology\nAttaining the Specified Profile\n\n\n\n\nReflow Oven types and characteristics\n\nConvection Dominant (Forced Convection)\nVapor Phase\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nIntrusive (Pin-in-Paste) Reflow \n\nWave Soldering\n\nMachine Types\nProfile Development\nProcess Considerations\n\n\nSelective Soldering\n\nAperture Fixtures\nSelective Soldering Machine Types\nProcess Considerations\nSelective Soldering DFM Considerations\nProfile Development\n\n\nCleaning\n\nContaminants and Corresponding Solvents\nEffectiveness of Aqueous Detergents\nCleaning Equipment (Batch and In-Line Systems)\nCleanability of Components\nDriving Forces for No Clean\nCleaning No Clean\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nInspection and Testing\n\nTesting and Controlling the Process Through SPC\nInspection Points and Strategies in the Process\nSPI\nAOI\nX-ray\nTesting Considerations\n\n\n\n\nSummary\nQuestions and Answers Session
URL:https://itmconsulting.com/event/smt-assembly-boot-camp-master-workshop-at-best-inc-auburn-hills-mi/
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20221010
DTEND;VALUE=DATE:20221012
DTSTAMP:20220913T182054Z
CREATED:20220913T171711Z
LAST-MODIFIED:20220913T182054Z
UID:1345-1665360000-1665532799@itmconsulting.com
SUMMARY:SMT Assembly Boot Camp Master Workshop at STI Electronics\, Madison\, AL
DESCRIPTION:The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through hole and surface mount technologies (SMT). It is a focused two-day long workshop\, which provides students with the opportunity to learn and understand the processes\, equipment\, and materials used in today’s manufacturing of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing-related fields. \nCombining a lecture\, discussion\, and some videos\, this electronic assembly basic training workshop was designed to give a very comprehensive and complete “immersion” into SMT and mixed technology PCB assembly. People who are new to the field\, as well as somewhat experienced personnel who want to “fill in the gaps\,” have found this workshop to be a perfect solution. \nAs it runs only two days\, it is extensive (and non-superfluous) without taking people “out of the shop” for an extended period of time: learn\, absorb\, and take that knowledge back to the manufacturing floor. \n\n\n\n\n\n\nDay One: Introduction – “It’s What We Do” \n\nPCB Fabrication Overview\n\nCircuit Board Fabrication Overview\nSurface Finish\nLegend\n\n\nSMT Assembly Materials\nSolder Paste  \n\nSolder Paste (Flux and Alloy)\nSolder Paste Characteristics\nSolder Paste Considerations\nAdhesives\n\n\nStencil Fabrication and Design\n\nStencil Components\nStencil Fabrication and Characteristics (Laser Cut\, Electroplating\, and Nano-Coating)\nFiducials\nAperture Design Rules\nSpecial Apertures\n\n\nSMT Assembly Processes and Equipment\nSolder Paste Printing and Deposition\n  \n\nSolder Paste (Composition and Attributes)\nSolder Deposition Basics\nProcess Parameters\, Control\, and Effects\nProcess Considerations\nProcess Defect Recognition and Avoidance\nSolder Jetting\n\n\nQuestions and Answers Session\n\n\n\n\n\n\n\n\n\n\n\n\n\nDay Two: Assembly Processes and Equipment (Continued) \n\nComponent Placement\n\nMachine Types and Characteristics\nFeeder Types (Attributes and Characteristics)\nPlacement Considerations and Parameters\nSet-Up and Change-Over\nAvoiding Placement Defects\nLine Balancing\n\n\nReflow Soldering\nReflow Profile  \n\nReflow Profile Characteristics\nReflow Specification Derivation\n\n\nPCBA profile development procedure\n\nThermocouple Location\nThermocouple Attachment Methodology\nAttaining the Specified Profile\n\n\n\n\nReflow Oven types and characteristics\n\nConvection Dominant (Forced Convection)\nVapor Phase\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nIntrusive (Pin-in-Paste) Reflow \n\nWave Soldering\n\nMachine Types\nProfile Development\nProcess Considerations\n\n\nSelective Soldering\n\nAperture Fixtures\nSelective Soldering Machine Types\nProcess Considerations\nSelective Soldering DFM Considerations\nProfile Development\n\n\nCleaning\n\nContaminants and Corresponding Solvents\nEffectiveness of Aqueous Detergents\nCleaning Equipment (Batch and In-Line Systems)\nCleanability of Components\nDriving Forces for No Clean\nCleaning No Clean\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nInspection and Testing\n\nTesting and Controlling the Process Through SPC\nInspection Points and Strategies in the Process\nSPI\nAOI\nX-ray\nTesting Considerations\n\n\n\n\nSummary\nQuestions and Answers Session
URL:https://itmconsulting.com/event/smt-assembly-boot-camp-master-workshop-at-sti-electronics-madison-al/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20221012T080000
DTEND;TZID=UTC:20221012T150000
DTSTAMP:20220913T181825Z
CREATED:20220913T181825Z
LAST-MODIFIED:20220913T181825Z
UID:1355-1665561600-1665586800@itmconsulting.com
SUMMARY:Understanding and Implementing Best Practices in Electronic Assembly Processes” Workshop at STI Electronics
DESCRIPTION:Jim Hall and Phil Zarrow of ITM Consulting will present world renowned  “SMT Assembly Boot Camp” workshop at STI Electronics\, Madison\, AL \n  \nITM Consulting is well-known for their capabilities and accomplishments in the field of electronic assembly processes\, materials\, and equipment.  In this workshop industry experts Jim Hall and  Phil Zarrow\, Principal Consultants at ITM will bring his experience and expertise to the forefront. \n  \nTaught by Jim Hall and Phil Zarrow of ITM Consulting\, this course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process\, materials (both existing and emerging)\, equipment\, procedures\, and methods. Most importantly\, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing\, developing\, managing and/or executing assembly line operations including managers\, line supervisors and line engineers involved in manufacturing\, design and quality engineering. \nThis course is intended for Manufacturing\, Process\, Design\, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.
URL:https://itmconsulting.com/event/understanding-and-implementing-best-practices-in-electronic-assembly-processes-workshop-at-sti-electronics/
LOCATION:STI Electronics  Madison\, AL  USA\, 261 Palmer Road\, Madison\, AL\, 35758\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20221013T080000
DTEND;TZID=UTC:20221013T143000
DTSTAMP:20230105T091804Z
CREATED:20220913T181254Z
LAST-MODIFIED:20230105T091804Z
UID:1353-1665648000-1665671400@itmconsulting.com
SUMMARY:SMT Assembly Troubleshooting and Process Optimization at STI Electronics
DESCRIPTION:Course Instructor:             Phil Zarrow and Jim Hall \nCourse Time:                      8:00 a.m. – 2:30 p.m. \nSMT Assembly Troubleshooting and Process Optimization – Lessons Learned from the Trenches and a Decade of Board Talk \nDescription of the Course \nIn over 30 years of consulting\, Phil and Jim have just about seen it all! You may be familiar with their popular podcast (started before podcasts existed)\, Board Talk\, which addresses industry issues with deep understanding and a sense of humor. Join the “Assembly Brothers” for a journey through troubleshooting the most common defects in SMT with an emphasis on identifying the fundamental root causes\, and an entertaining overview of SMT assembly process optimization techniques. \nTopics Include: \n\nWhy do we get voids in certain solder joints?\nDo we need to clean No-Clean residues before Conformal Coating?\nWhat is Causing Intermittent BGA Failures?\nShould We Measure Solder Paste Thickness?\nAre there effective countermeasures to “new” defects such as “Graping”\, HoP\, etc.?\nShould we consider changing to a newer Solder Paste formulation?\nWhat are the Pros and Cons of Cleaning No-Clean?\nWhat are potential issues with introducing Ultra-miniature chip components into products?\nDoes Your Assembly Line Suffer From Floundering Time?\nHow can we reduce tombstoning?\nCan We Skip Cleaning After Rework?\nWhat are the best practices for storing and handling PCB’s?\nHow to build a “proper” profile board to set up a Reflow Oven ?\nHow can we achieve adequate hole fill in wave soldering?\nCan we mix conformal coatings during rework?\nWill typical No-Clean residues pass an SIR Test?\nWhat causes “Icicles” during wave soldering?\nSolder pallets with titanium inserts: yes or no?\nOthers\n\nQ & A – “Stump the Chumps”: Jim and Phil answer process questions from participants \n 
URL:https://itmconsulting.com/event/smt-assembly-troubleshooting-and-process-optimization-at-sti-electronics/
LOCATION:STI Electronics  Madison\, AL  USA\, 261 Palmer Road\, Madison\, AL\, 35758\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20250317T083000
DTEND;TZID=UTC:20250317T123000
DTSTAMP:20250306T175006Z
CREATED:20250306T174943Z
LAST-MODIFIED:20250306T175006Z
UID:1407-1742200200-1742214600@itmconsulting.com
SUMMARY:ITM Troubleshooting Workshop at APEX 2025
DESCRIPTION:Jim Hall and Phil Zarrow will present SMT TROUBLESHOOTING Workshop at the IPC APEX Show and Conference on March 17 and 18 (two half-day sessions). \nBased upon their best-selling Board Talk book. \nContact IPC.org for more information and sign-up \n 
URL:https://itmconsulting.com/event/itm-troubleshooting-workshop-at-apex-2025/
LOCATION:IPC APEX EXPO 2021\, Virtual
ORGANIZER;CN="IPC":MAILTO:AndreaKeefe@IPC.org
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