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UID:1243-1660552200-1660755600@itmconsulting.com
SUMMARY:SMT Assembly Boot Camp Master Workshop at BEST Inc\, Rolling Meadows\, IL
DESCRIPTION:The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through hole and surface mount technologies (SMT). It is a focused two-day long workshop\, which provides students with the opportunity to learn and understand the processes\, equipment\, and materials used in today’s manufacturing of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing-related fields. \nCombining a lecture\, discussion\, and some videos\, this electronic assembly basic training workshop was designed to give a very comprehensive and complete “immersion” into SMT and mixed technology PCB assembly. People who are new to the field\, as well as somewhat experienced personnel who want to “fill in the gaps\,” have found this workshop to be a perfect solution. \nAs it runs only two days\, it is extensive (and non-superfluous) without taking people “out of the shop” for an extended period of time: learn\, absorb\, and take that knowledge back to the manufacturing floor. \n\n\n\n\n\n\nDay One: Introduction – “It’s What We Do” \n\nPCB Fabrication Overview\n\nCircuit Board Fabrication Overview\nSurface Finish\nLegend\n\n\nSMT Assembly Materials\nSolder Paste \n\nSolder Paste (Flux and Alloy)\nSolder Paste Characteristics\nSolder Paste Considerations\nAdhesives\n\n\nStencil Fabrication and Design\n\nStencil Components\nStencil Fabrication and Characteristics (Laser Cut\, Electroplating\, and Nano-Coating)\nFiducials\nAperture Design Rules\nSpecial Apertures\n\n\nSMT Assembly Processes and Equipment\nSolder Paste Printing and Deposition\n \n\nSolder Paste (Composition and Attributes)\nSolder Deposition Basics\nProcess Parameters\, Control\, and Effects\nProcess Considerations\nProcess Defect Recognition and Avoidance\nSolder Jetting\n\n\nQuestions and Answers Session\n\n\n\n\n\n\n\n\n\n\n\n\n\nDay Two: Assembly Processes and Equipment (Continued) \n\nComponent Placement\n\nMachine Types and Characteristics\nFeeder Types (Attributes and Characteristics)\nPlacement Considerations and Parameters\nSet-Up and Change-Over\nAvoiding Placement Defects\nLine Balancing\n\n\nReflow Soldering\nReflow Profile \n\nReflow Profile Characteristics\nReflow Specification Derivation\n\n\nPCBA profile development procedure\n\nThermocouple Location\nThermocouple Attachment Methodology\nAttaining the Specified Profile\n\n\n\n\nReflow Oven types and characteristics\n\nConvection Dominant (Forced Convection)\nVapor Phase\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nIntrusive (Pin-in-Paste) Reflow \n\nWave Soldering\n\nMachine Types\nProfile Development\nProcess Considerations\n\n\nSelective Soldering\n\nAperture Fixtures\nSelective Soldering Machine Types\nProcess Considerations\nSelective Soldering DFM Considerations\nProfile Development\n\n\nCleaning\n\nContaminants and Corresponding Solvents\nEffectiveness of Aqueous Detergents\nCleaning Equipment (Batch and In-Line Systems)\nCleanability of Components\nDriving Forces for No Clean\nCleaning No Clean\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nInspection and Testing\n\nTesting and Controlling the Process Through SPC\nInspection Points and Strategies in the Process\nSPI\nAOI\nX-ray\nTesting Considerations\n\n\n\n\nSummary\nQuestions and Answers Session
URL:https://itmconsulting.com/event/smt-assembly-boot-camp-master-workshop-at-best-inc-auburn-hills-mi/
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20220518
DTEND;VALUE=DATE:20220520
DTSTAMP:20220331T160821Z
CREATED:20220331T160342Z
LAST-MODIFIED:20220331T160821Z
UID:1262-1652832000-1653004799@itmconsulting.com
SUMMARY:Understanding and Implementing Best Practices in  Electronic Assembly Processes Workshop - Rolling Meadows\, IL  May 19-19-2022
DESCRIPTION:Understanding and Implementing Best Practices in Electronic Assembly Processes Workshop  \nat B.E.S.T.\, Rolling Meadows\, IL  \nMay 18-19-2022  \nTaught by Jim Hall and Phil Zarrow of ITM Consulting\, this course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process\, materials (both existing and emerging)\, equipment\, procedures\, and methods. Most importantly\, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing\, developing\, managing and/or executing assembly line operations including managers\, line supervisors and line engineers involved in manufacturing\, design and quality engineering. \n\nThis course is intended for Manufacturing\, Process\, Design\, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.
URL:https://itmconsulting.com/event/understanding-and-implementing-best-practices-in-electronic-assembly-processes-workshop-rolling-meadows-il-may-19-19-2022/
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20220502
DTEND;VALUE=DATE:20220504
DTSTAMP:20220331T144611Z
CREATED:20220331T144611Z
LAST-MODIFIED:20220331T144611Z
UID:1256-1651449600-1651622399@itmconsulting.com
SUMMARY:SMT ASSEMBLY "BOOT CAMP" at B.E.S.T. Auburn Hills\, MI
DESCRIPTION:The SMT Electronics “Boot Camp” Workshop is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long workshop\, which provides students with the opportunity to learn and understand the processes\, equipment\, and materials used in today’s manufacture of electronic assemblies. It is taught by an experienced\, knowledgeable and entertaining instructor who has worked in a variety of electronics manufacturing related fields. \nCombining lecture\, videos and discussion\, this Electronic Assembly “basic training” workshop was designed to give a very comprehensive and complete ‘immersion’ into SMT and mixed technology PCB assembly.  People who are new to the field as well as somewhat experienced personnel who want to “fill in the gaps” have found this workshop to be a perfect solution.  As it runs only three days\, it is extensive (and non-superfluous) without taking people ‘out of the shop’ for an extended period of time: learn\, absorb and take that knowledge back to the manufacturing floor.
URL:https://itmconsulting.com/event/smt-assembly-boot-camp-at-b-e-s-t-auburn-hills-mi/
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