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DTSTART;VALUE=DATE:20221010
DTEND;VALUE=DATE:20221012
DTSTAMP:20260606T010702
CREATED:20220913T171711Z
LAST-MODIFIED:20220913T182054Z
UID:1345-1665360000-1665532799@itmconsulting.com
SUMMARY:SMT Assembly Boot Camp Master Workshop at STI Electronics\, Madison\, AL
DESCRIPTION:The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through hole and surface mount technologies (SMT). It is a focused two-day long workshop\, which provides students with the opportunity to learn and understand the processes\, equipment\, and materials used in today’s manufacturing of electronic assemblies. It is taught by an experienced and knowledgeable instructor who has worked in a variety of electronics manufacturing-related fields. \nCombining a lecture\, discussion\, and some videos\, this electronic assembly basic training workshop was designed to give a very comprehensive and complete “immersion” into SMT and mixed technology PCB assembly. People who are new to the field\, as well as somewhat experienced personnel who want to “fill in the gaps\,” have found this workshop to be a perfect solution. \nAs it runs only two days\, it is extensive (and non-superfluous) without taking people “out of the shop” for an extended period of time: learn\, absorb\, and take that knowledge back to the manufacturing floor. \n\n\n\n\n\n\nDay One: Introduction – “It’s What We Do” \n\nPCB Fabrication Overview\n\nCircuit Board Fabrication Overview\nSurface Finish\nLegend\n\n\nSMT Assembly Materials\nSolder Paste  \n\nSolder Paste (Flux and Alloy)\nSolder Paste Characteristics\nSolder Paste Considerations\nAdhesives\n\n\nStencil Fabrication and Design\n\nStencil Components\nStencil Fabrication and Characteristics (Laser Cut\, Electroplating\, and Nano-Coating)\nFiducials\nAperture Design Rules\nSpecial Apertures\n\n\nSMT Assembly Processes and Equipment\nSolder Paste Printing and Deposition\n  \n\nSolder Paste (Composition and Attributes)\nSolder Deposition Basics\nProcess Parameters\, Control\, and Effects\nProcess Considerations\nProcess Defect Recognition and Avoidance\nSolder Jetting\n\n\nQuestions and Answers Session\n\n\n\n\n\n\n\n\n\n\n\n\n\nDay Two: Assembly Processes and Equipment (Continued) \n\nComponent Placement\n\nMachine Types and Characteristics\nFeeder Types (Attributes and Characteristics)\nPlacement Considerations and Parameters\nSet-Up and Change-Over\nAvoiding Placement Defects\nLine Balancing\n\n\nReflow Soldering\nReflow Profile  \n\nReflow Profile Characteristics\nReflow Specification Derivation\n\n\nPCBA profile development procedure\n\nThermocouple Location\nThermocouple Attachment Methodology\nAttaining the Specified Profile\n\n\n\n\nReflow Oven types and characteristics\n\nConvection Dominant (Forced Convection)\nVapor Phase\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nIntrusive (Pin-in-Paste) Reflow \n\nWave Soldering\n\nMachine Types\nProfile Development\nProcess Considerations\n\n\nSelective Soldering\n\nAperture Fixtures\nSelective Soldering Machine Types\nProcess Considerations\nSelective Soldering DFM Considerations\nProfile Development\n\n\nCleaning\n\nContaminants and Corresponding Solvents\nEffectiveness of Aqueous Detergents\nCleaning Equipment (Batch and In-Line Systems)\nCleanability of Components\nDriving Forces for No Clean\nCleaning No Clean\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nInspection and Testing\n\nTesting and Controlling the Process Through SPC\nInspection Points and Strategies in the Process\nSPI\nAOI\nX-ray\nTesting Considerations\n\n\n\n\nSummary\nQuestions and Answers Session
URL:https://itmconsulting.com/event/smt-assembly-boot-camp-master-workshop-at-sti-electronics-madison-al/
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