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SUMMARY:ITM Troubleshooting Workshop at APEX 2025
DESCRIPTION:Jim Hall and Phil Zarrow will present SMT TROUBLESHOOTING Workshop at the IPC APEX Show and Conference on March 17 and 18 (two half-day sessions). \nBased upon their best-selling Board Talk book. \nContact IPC.org for more information and sign-up \n 
URL:https://itmconsulting.com/event/itm-troubleshooting-workshop-at-apex-2025/
LOCATION:IPC APEX EXPO 2021\, Virtual
ORGANIZER;CN="IPC":MAILTO:AndreaKeefe@IPC.org
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DTSTART;VALUE=DATE:20210311
DTEND;VALUE=DATE:20210312
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SUMMARY:TROUBLESHOOTING AND PROCESS OPTIMIZATION
DESCRIPTION:Troubleshooting and Process Optimization\n– Lessons Learned from the Trenches and a Decade of Board Talk \nPhil Zarrow & Jim Hall    ITM Consulting   Full Day      9:00 am – 12:00 pm & 2:00 pm – 5:00 pm \nIn over 25 years of consulting\, Phil and Jim have just about seen it all! You may be familiar with their popular podcast (started before podcasts existed)\, Board Talk\, which addresses industry issues with deep understanding and a sense of humor. Join the “Assembly Brothers” for a journey through troubleshooting the most common defects in SMT with an emphasis on identifying the fundamental root causes\, and an entertaining overview of best practices. \nTopics Include: \nIssue Questions from the BoardTalk Crypt: \n\nWhy do we get voids in certain solder joints?\nDo we need to clean No-Clean residues before Conformal Coating?\nWhat is Causing Intermittent BGA Failures?\nShould We Measure Solder Paste Thickness?\nAre there effective countermeasures to “new” defects such as “Graping”\, HoP\, etc.?\nShould we consider changing to a newer Solder Paste formulation?\nWhat are the Pros and Cons of Cleaning No-Clean?\nIs HASL a Good Choice for Surface Finish?\nShould we change from Water Soluble fluxes to No-Clean?\nWhat are potential issues with introducing Ultra-miniature chip components into our products?\nWill Nitrogen Reduce Reflow and/or Wave Solder Defects?\nDoes Your Assembly Line Suffer From Floundering Time?\nAre There Standards Governing Component Polarity Marks?\nHow can we reduce tombstoning?\nCan We Skip Cleaning After Rework?\nWhat are the best practices for storing and handling PCB’s?\nHow to build a “proper” profile board to set up a Reflow Oven ?\nWhy has Vapor Phase Reflow come back ?\nHow can we achieve adequate hole fill in wave soldering?\nCan we mix conformal coatings during rework?\nWill typical No-Clean residues pass an SIR Test?\nWhat causes “Icicles” during wave soldering?\nSolder pallets with titanium inserts: yes or no?\nHow do you remove oxidation from PCB’s?\n\nQ & A – “Stump the Chumps”:  Jim and Phil will answer process questions from participants as time permits. \nWho Should Attend: \n\nThis course is intended for Manufacturing\, Process\, Design\, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.  If you’re involved with SMT assembly and you’ve never encountered defects\, you can take a pass on this workshop.
URL:https://itmconsulting.com/event/troubleshooting-and-process-optimization/
LOCATION:IPC APEX EXPO 2021\, Virtual
ORGANIZER;CN="IPC":MAILTO:AndreaKeefe@IPC.org
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