Failure Analysis in Semiconductor Package Assembly

This PDC provides details on current failure analysis methods and reliability testing in package assembly.

PDC participants will receive a detailed review of failure analysis methods and reliability testing in assembly. Quickly finding and eliminating package defects and failures due to assembly issues is critical. Package reliability directly affects manufacturing yield, time to market, product performance, customer satisfaction and cost. Many process steps and controls are needed for a high yield and reliable assembly process. A thorough understanding of product and technology reliability principles and mechanisms of failure is essential. Knowledge of defects and failure mechanisms enables a high yielding successful assembly process through material choices, package design, process optimization, and thermo-mechanical considerations. Fault isolation, failure analysis, and materials analysis play a major role in the improvement of yield and reliability. Coordination of engineers from many disciplines is needed in order to achieve high yield and reliability. Each engineer needs to understand the impact of their choices and methods on the final product. This PDC will discuss, using examples, mechanical and thermal failure mechanisms in assembly and detection methods. 

The objective is to provide the participants with an overview of the technologies, materials, and processes involved in the latest assembly failure analysis methods.