Resources to Help You Improve Your Company's Performance
Articles
- Book Review: Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies
- Contract Assembly Terms and Definitions
- Current Challenges and Applications in SMT Reflow Soldering
- Pin-In-Paste / Intrusive Reflow Soldering
- MSD - Not a Dry Subject
- Selective Soldering
Books - Available at ITM STORE:
"Troubleshooting Electronic Assembly- Tales from the BoardTalk Crypt" by Phil Zarrow and Jim Hall
"Best Practices in Electronic Assembly" Coursebook
"Low-Volume - High Mix SMT Manufacturing" Coursebook
"The Deadly Sins of SMT and Lead-Free Manufacturing" Coursebook
Interviews:
https://globalsmt.net/interviews/lnterview-jim-hall-and-phil-zarrow/
