Resources

Resources to Help You Improve Your Company's Performance

Articles

  • Book Review: Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies
  • Contact Assembly Terms
  • Current Challenges and Applications in SMT Reflow Soldering
  • Pin-In-Paste / Intrusive Reflow Soldering
  • MSD - Not a Dry Subject
  • Selective Soldering
  • Adhesive Deposition (12-95)
  • OSPs (2-96)
  • Conductive Epoxies (4-96)
  • Component Technology Decisions and Issues (6-96)
  • SMT Assembly Evolution (8-96)
  • Component Placement Systms (10-96)
  • What's the BFD about BGAs (12-96)
  • Space - Yet Another Frontier (2-97)
  • Reflow Profiling - It's Not An Adventure J It's a Job (4-97)
  • Current Challenges and Applications in SMT Reflow Soldering (5-95)
  • Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components
  • ITM Process Audit Tech Paper
  • ITM Consulting 2021 Circuitnet Viewpoint
  • ITM Competitive Landscape Tech Paper
  • Go to Market Strategy for the US

Books - Available at ITM STORE:

"Troubleshooting Electronic Assembly- Tales from the BoardTalk Crypt"  by Phil Zarrow and Jim Hall

"Best Practices in Electronic Assembly" Coursebook

"Low-Volume - High Mix SMT Manufacturing" Coursebook

"The Deadly Sins of SMT and Lead-Free Manufacturing" Coursebook

Interviews:

https://globalsmt.net/interviews/lnterview-jim-hall-and-phil-zarrow/

ITM Consulting
  • Adhesive Deposition (12-95)
  • OSPs (2-96)
  • Conductive Epoxies (4-96)
  • Component Technology Decisions and Issues (6-96)
  • SMT Assembly Evolution (8-96)
  • Component Placement Systms (10-96)
  • What's the BFD about BGAs (12-96)
  • Space - Yet Another Frontier (2-97)
  • Reflow Profiling - It's Not An Adventure J It's a Job (4-97)
  • Current Challenges and Applications in SMT Reflow Soldering (5-95)
ITM Consulting