Resources

Resources to Help You Improve Your Company's Performance

Go to Market Strategy for the US

Name*
Email*
Company*
Country*
Country
CAPTCHA
Name
This field is for validation purposes and should be left unchanged.

ITM Competitive Landscape Tech Paper

Name*
Email*
Company*
Country*
Country
CAPTCHA
Email
This field is for validation purposes and should be left unchanged.

ITM Consulting 2021 Circuitnet Viewpoint

Name*
Email*
Company*
Country*
Country
CAPTCHA
Comments
This field is for validation purposes and should be left unchanged.

ITM Process Audit Tech Paper

Name*
Email*
Company*
Country*
Country
CAPTCHA
Name
This field is for validation purposes and should be left unchanged.

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Name*
Email*
Company*
Country*
Country
CAPTCHA
Name
This field is for validation purposes and should be left unchanged.

Book Review: Reflow Soldering

Name*
Email*
Company*
Country*
Country
CAPTCHA
Email
This field is for validation purposes and should be left unchanged.

Contact Assembly Terms

Name*
Email*
Company*
Country*
Country
CAPTCHA
Name
This field is for validation purposes and should be left unchanged.

Current Challenges

Name*
Email*
Company*
Country*
Country
CAPTCHA
Email
This field is for validation purposes and should be left unchanged.

Pin-in-Paste

Name*
Email*
Company*
Country*
Country
CAPTCHA
Comments
This field is for validation purposes and should be left unchanged.

MSD

Name*
Email*
Company*
Country*
Country
CAPTCHA
Comments
This field is for validation purposes and should be left unchanged.

Selective Soldering

Name*
Email*
Company*
Country*
Country
CAPTCHA
Comments
This field is for validation purposes and should be left unchanged.

Adhesive Deposition (12-95)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Phone
This field is for validation purposes and should be left unchanged.

OSPs (2-96)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Email
This field is for validation purposes and should be left unchanged.

Conductive Epoxies (4-96)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Phone
This field is for validation purposes and should be left unchanged.

Component Technology Decisions and Issues (6-96)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Phone
This field is for validation purposes and should be left unchanged.

SMT Assembly Evolution (8-96)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Comments
This field is for validation purposes and should be left unchanged.

Component Placement Systms (10-96)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Email
This field is for validation purposes and should be left unchanged.

What's the BFD about BGAs (12-96)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Name
This field is for validation purposes and should be left unchanged.

Space - Yet Another Frontier (2-97)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Phone
This field is for validation purposes and should be left unchanged.

Reflow Profiling - It's Not An Adventure J It's a Job (4-97)

Name*
Email*
Company*
Country*
Country
CAPTCHA
Comments
This field is for validation purposes and should be left unchanged.

Integrated

Name*
Email*
Company*
Country*
Country
CAPTCHA
Phone
This field is for validation purposes and should be left unchanged.

Simultaneous

Name*
Email*
Company*
Country*
Country
CAPTCHA
Phone
This field is for validation purposes and should be left unchanged.

Thermomechanical

Name*
Email*
Company*
Country*
Country
CAPTCHA
Name
This field is for validation purposes and should be left unchanged.

High-Density

Name*
Email*
Company*
Country*
Country
CAPTCHA
Email
This field is for validation purposes and should be left unchanged.

Copper

Name*
Email*
Company*
Country*
Country
CAPTCHA
Comments
This field is for validation purposes and should be left unchanged.

Articles

Book Review: Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies

Contact Assembly Terms

Current Challenges and Applications in SMT Reflow Soldering

Pin-In-Paste / Intrusive Reflow Soldering

MSD - Not a Dry Subject

Selective Soldering

Adhesive Deposition (12-95)

OSPs (2-96)

Conductive Epoxies (4-96)

Component Technology Decisions and Issues (6-96)

SMT Assembly Evolution (8-96)

Component Placement Systms (10-96)

What's the BFD about BGAs (12-96)

Space - Yet Another Frontier (2-97)

Reflow Profiling - It's Not An Adventure J It's a Job (4-97)

Current Challenges and Applications in SMT Reflow Soldering (5-95)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

ITM Process Audit Tech Paper

ITM Consulting 2021 Circuitnet Viewpoint

ITM Competitive Landscape Tech Paper

Go to Market Strategy for the US

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification.

Simultaneous Chip Join and Underfill Assembly Technology for Flip Chip Packaging

Thermomechanical Failure in Silicon Devices.

High-Density Compliant Die-Package Interconnect

Copper Via Plating in Three Dimensional Interconnects

Books - Available at ITM STORE:

"Troubleshooting Electronic Assembly- Tales from the BoardTalk Crypt" by Phil Zarrow and Jim Hall

"Best Practices in Electronic Assembly" Coursebook

"Low-Volume - High Mix SMT Manufacturing" Coursebook

"The Deadly Sins of SMT and Lead-Free Manufacturing" Coursebook

Interviews:

https://globalsmt.net/interviews/lnterview-jim-hall-and-phil-zarrow/

Articles

Adhesive Deposition (12-95)

OSPs (2-96)

Conductive Epoxies (4-96)

Component Technology Decisions and Issues (6-96)

SMT Assembly Evolution (8-96)

Component Placement Systms (10-96)

What's the BFD about BGAs (12-96)

Space - Yet Another Frontier (2-97)

Reflow Profiling - It's Not An Adventure J It's a Job (4-97)

Current Challenges and Applications in SMT Reflow Soldering (5-95)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

ITM Process Audit Tech Paper

ITM Consulting 2021 Circuitnet Viewpoint

ITM Competitive Landscape Tech Paper

Go to Market Strategy for the US

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification.

Simultaneous Chip Join and Underfill Assembly Technology for Flip Chip Packaging

Thermomechanical Failure in Silicon Devices.

High-Density Compliant Die-Package Interconnect

Copper Via Plating in Three Dimensional Interconnects