Resources

Resources to Help You Improve Your Company's Performance

Go to Market Strategy for the US

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ITM Competitive Landscape Tech Paper

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ITM Consulting 2021 Circuitnet Viewpoint

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ITM Process Audit Tech Paper

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Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

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Book Review: Reflow Soldering

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Contact Assembly Terms

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Current Challenges

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Pin-in-Paste

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MSD

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Selective Soldering

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Adhesive Deposition (12-95)

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OSPs (2-96)

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Conductive Epoxies (4-96)

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Component Technology Decisions and Issues (6-96)

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SMT Assembly Evolution (8-96)

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Component Placement Systms (10-96)

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What's the BFD about BGAs (12-96)

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Space - Yet Another Frontier (2-97)

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Reflow Profiling - It's Not An Adventure J It's a Job (4-97)

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Integrated

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Simultaneous

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Thermomechanical

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High-Density

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Copper

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Articles

Book Review: Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies

Contact Assembly Terms

Current Challenges and Applications in SMT Reflow Soldering

Pin-In-Paste / Intrusive Reflow Soldering

MSD - Not a Dry Subject

Selective Soldering

Adhesive Deposition (12-95)

OSPs (2-96)

Conductive Epoxies (4-96)

Component Technology Decisions and Issues (6-96)

SMT Assembly Evolution (8-96)

Component Placement Systms (10-96)

What's the BFD about BGAs (12-96)

Space - Yet Another Frontier (2-97)

Reflow Profiling - It's Not An Adventure J It's a Job (4-97)

Current Challenges and Applications in SMT Reflow Soldering (5-95)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

ITM Process Audit Tech Paper

ITM Consulting 2021 Circuitnet Viewpoint

ITM Competitive Landscape Tech Paper

Go to Market Strategy for the US

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification.

Simultaneous Chip Join and Underfill Assembly Technology for Flip Chip Packaging

Thermomechanical Failure in Silicon Devices.

High-Density Compliant Die-Package Interconnect

Copper Via Plating in Three Dimensional Interconnects

Books - Available at ITM STORE:

"Troubleshooting Electronic Assembly- Tales from the BoardTalk Crypt" by Phil Zarrow and Jim Hall

"Best Practices in Electronic Assembly" Coursebook

"Low-Volume - High Mix SMT Manufacturing" Coursebook

"The Deadly Sins of SMT and Lead-Free Manufacturing" Coursebook

Interviews:

lnterview: Jim Hall and Phil Zarrow

Articles

Adhesive Deposition (12-95)

OSPs (2-96)

Conductive Epoxies (4-96)

Component Technology Decisions and Issues (6-96)

SMT Assembly Evolution (8-96)

Component Placement Systms (10-96)

What's the BFD about BGAs (12-96)

Space - Yet Another Frontier (2-97)

Reflow Profiling - It's Not An Adventure J It's a Job (4-97)

Current Challenges and Applications in SMT Reflow Soldering (5-95)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

ITM Process Audit Tech Paper

ITM Consulting 2021 Circuitnet Viewpoint

ITM Competitive Landscape Tech Paper

Go to Market Strategy for the US

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification.

Simultaneous Chip Join and Underfill Assembly Technology for Flip Chip Packaging

Thermomechanical Failure in Silicon Devices.

High-Density Compliant Die-Package Interconnect

Copper Via Plating in Three Dimensional Interconnects