Modern Wire Bonding in Package Assembly

Course Description: Wire bonding infrastructure is so extensive that no other chip-interconnection technology can completely displace wire bonding in the foreseeable future. Participants in this PDC will receive an overview of current high volume manufacturing, HVM, wire bonding assembly process options and metrology challenges. Wirebonding produces the electrical connection between the die and package using a type of welding. Wirebond pitch shrinkage is critical as the number of bond pads that must be placed per unit area increases. This requires a leap in wire manufacturing capability and improved wire bonding tools and metrology. Current challenging assembly processes including direct wirebonding to Cu pads on ULK materials, new wire materials including silver and gold-coated palladium-coated copper wire will be reviewed. Different methods of wire bonding such as thermosonic, ultrasonic and thermocompression will be covered in this workshop. Several options for Cu wire with palladium coating are also discussed. 

The PDC will review the differences between ball and wedge bonding methods and stitch bonds including the advantages of each method. An in-depth review of wire bonding processes in assembly manufacturing and first level interconnects are presented. Wire bonding quality testing including wire pull and sheer test are discussed. Wire bonding for chip on board, COB applications, organic substrates, wire bonding problems using Au, Al or Cu wire and tape automated bonding are part of the PDC.