BOARD TALKPrincipal Consultant
Tom Zanatta brings to ITM Consulting extensive knowledge in viable, cost-effective solutions for manufacturing, operations, and technological challenges while meeting product requirements. His involvement in PCBA assembly and design over the last 30 years has included solving strategic challenges, developing and improving processes, and reducing expenses wherever possible. While serving as Principal Engineer at Zebra Technologies, Mr. Zanatta’s accomplishments include:
• Served as core team member on development and qualification of advanced manufacturing technologies including BGA, CSP, Flip Chip, and RFID technologies.
• Experience in surface-mount equipment, 2D and 3D X-ray, digital microscopes, elemental analysis equipment, general electronic test equipment, and mechanical measuring devices.
• Led research and development of innovative solutions for emerging technologies. • Utilized excellent communication and presentation skills in training engineering teams on various projects.
• Guided successful integration of advanced manufacturing technologies into high-mix and medium-volume manufacturing of durable mobile computing and data capture systems.
• Exceeded targets of $3M to $5M in annual cost savings and cost avoidances and proposed engineering solutions for product malfunctions.
• Proposed component and material test methods for Printed Circuit Boards avoiding inventory scrap, saving over $10M.
• Transitioned Motorola Bluetooth designs to Zebra Technology, ensuring regulatory, compliance, and overall product reliability and performance and resulting in two-year revenue realization of $8M.
• Implemented new product introduction process improvements for internal labs and CEMs.
• Mentored other up-and-coming engineering associates to drive consistent teamwork- and quality-first mentality.
While at Motorola, Mr. Zanatta:
• Served as corporate lead to support company’s environmental compliance efforts, ensuring product compliance related to conflict minerals and RoHS inquiries.
• Analyzed product failures, leading to successful outcome by managing technical obstructions and overcoming supplier and ODM limitations.
• Studied and investigated product use environments through finite element analysis and environmental testing, resulting in increased product reliability.
• Mr. Zanatta is active in the Surface Mount Technology Association (SMTA), the International Microelectronics Assembly and Packaging Society (IMAPS) as well as an Advisory Board Member at State University New York Farmingdale.
